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  • Home
    • Board of Directors
  • Members
    • Membership information
    • Application Form
    • Membership Criteria
    • Alberta
    • British Columbia
    • Manitoba
    • Northwest Territories
    • Atlantic Provinces
    • Nunavut
    • Ontario
    • Quebec
    • Saskatchewan
    • Yukon
    • Update provincial rep information
  • Inspections
    • Inspector application form
    • Order an inspection
    • Quality Assurance specification guide
    • QAP in a box
  • Education & events
    • Members Education Library
    • Lunch n learn downloads
  • NFCA Reference Manual
  • Blog
  • Contact

Mat Bond (Pull) Tests

These tests are performed by the Floor Covering Contractor once 'service' (occupancy) conditions have been reached. A test patch of flooring is adhered to the subfloor, using all of the products planned for the installation. This will included replicating any surface treatment, applying any moisture barriers, cement or gypsum underlayment, primers, wooden paneling, and adhesives. 
A piece of the scheduled floor covering is then stuck to the subfloor, taped around the edges, left for 72 hours and then pulled up. Reproducing the flooring system exactly is essential to ensuring this test is effective. The floor covering contractor must video record the execution of the test and photograph the subfloor surface and back of the floor covering close up for adhesive transfer inspection.  For resilient flooring, this test must be carried out in strict accordance with:
  • ASTM F3311, Standard Practice for Mat Bond Evaluation of Performance and Compatibility for Resilient Flooring Systems Components Prior to Installation.
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Failure Modes in Adhesive Mat Bond Testing.
The results of adhesive mat bond testing are a measure of the resistance of the floor covering to separate from the substrate when force is applied. This result allows for the determination of the failure mode. Three type of adhesive mat bond failure seen most frequently are substrate failure, adhesion failure or cohesive failure.
  • Substrate Failure This failure mode is expressed when the substrate or flooring material is weaker than the adhesive and cohesive bonds. It is characterized by either the material breaking apart and/or the substrate being separated into pieces or destroyed. This typically indicates high bond strength.
  • Adhesion Failure This failure mode is expressed when the bond between the substrate or flooring material and the adhesive is broken. It is characterized by all or most of the adhesive releasing from the substrate or from the material. This typically indicates the presence of a contaminant, very low porosity of the substrate or incorrect installation of the material into the adhesive.
  • Cohesive Failure This failure mode is expressed when the bond between the molecules within the adhesive is forced to failure because the external force being applied exceeds the cohesive bond. This typically indicates high bond strength.
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